Agilent ADS 2011
Advanced Design System (ADS) 2011 includes:
* Multi-Technology Co-Design - the industry's first and only true
multi-technology design environment
* High Speed Digital - IBIS-AMI SerDes model simulation and the industry's
first Power Integrity solution for heavily perforated power ground planes
* Integrated Electromagnetic Solvers - for faster, more accurate simulations;
and a new use model that makes it easier to setup and run 3D planar and full
3D electromagnetic simulations
* New Load Pull Data Controller - from load pull data to design and simulation
in a couple of clicks
* New Layout Improvements - layout capacity and performance to handle growing
complexity
* Dozens of other improvements - including re-designed icons for layout and
command menus, linear simulation speedup, broader data display capability,
and improved transmission line models
ADS 2011 features capabilities that help uncover and resolve integration issues
early in the design process, before fabrication of wireless components like
power amplifiers and RF front-end modules. It also offers engineers the ability
to design multiple RF and microwave integrated circuits (implemented with a
variety of technologies), assemble them in a package or on a multilayer
laminate, and simulate electrical and 3-D electromagnetic performance all
within a single platform. With ADS 2011, design verification no longer needs to
stop at the boundary of a single integrated circuit’s or module’s technology.
Multi-Technology Co-Design
Multi-technology design allows multiple IC’s combined with laminate and
packaging PCB to all be designed together. Tradeoffs can be made interactively
on the IC, laminate, packaging and print circuit boards being designed or
co-designed together. Using ADS 2011, engineers can design individual RF and
microwave integrated circuits with different technologies (e.g., GaAs, SiGe,
GaN, and Silicon CMOS).
High Speed Digital
Unique capability added for Power Integrity analysis on PCBs and packages with
heavily perforated power ground planes. ADS 2011 offers accurate modeling of
multi-GHz effects with an easy setup via our SI/PI analysis tool. IBIS-AMI
model simulation support for fast, accurate SerDes models for ‘what if’ channel
simulation. Learn more about Design and Simulation of High Speed Digital.
Integrated Electromagnetic Solvers
Simulate multiple integrated circuits (laminate and package) with Agilent’s
industry-leading simulation technology.
Uncover 3-D electromagnetic interactions of bondwires, solder balls, packages,
including traces and spiral inductors on the integrated circuits and laminates
Updated Momentum solver offers over 4x simulation speed improvement
New Streamlined EM Setup allows the same setup for Momentum, Momentum RF,
& FEM making it easy to try different solvers on the same design
New Integrated EM Port Viewer/Editor for more efficient port editing and
management Export layout designs to, a nd import 3D components from
Electromagnetic Professional (EMPro). Learn more about EMPro 3D EM Simulation
Software.
New Load Pull Data Controller
The new load pull data controller allows for direct, instant loading of load
pull data and can handle multiple files for easier review of data. ADS 2011
users can immediately use data to simulate matching networks making it easier
for design optimization, including improved discrete optimization and the
automatic interpolation of scattered measurement data.
New Layout Improvements
The unified graphical layer definition allows for a single, unified entry of
layer and stackup data. Thus saving time and eliminating errors due to
inconsistent entries. ADS 2011’s native physical multi-substrate support makes
adding multiple substrates as easy as placing a component and offers unlimited
levels of technology stacking (i.e. IC on a module on a PCB).
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